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Thermal Gap Filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan Thermal Conductive TIF100-200S

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Thermal Gap Filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan Thermal Conductive TIF100-200S from wholesalers
     
    Buy cheap Thermal Gap Filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan Thermal Conductive TIF100-200S from wholesalers
    • Buy cheap Thermal Gap Filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan Thermal Conductive TIF100-200S from wholesalers
    • Buy cheap Thermal Gap Filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan Thermal Conductive TIF100-200S from wholesalers
    • Buy cheap Thermal Gap Filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan Thermal Conductive TIF100-200S from wholesalers
    • Buy cheap Thermal Gap Filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan Thermal Conductive TIF100-200S from wholesalers

    Thermal Gap Filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan Thermal Conductive TIF100-200S

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF100-200S
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    Thermal Gap Filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan Thermal Conductive TIF100-200S

    thermal gap filler In High Speed Mass Storage Drives 2.0 W/M-K Cyan thermal conductive TIF100-200S

    Company Profile
    Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

    The TIF100-200S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


    Features:
    > Good thermal conductive:1.5W/mK
    > Naturally tacky needing no further adhesive coating
    > Soft and Compressible for low stress applications
    > Available in varies thickness
    Applications:
    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)

    Typical Properties of TIF™100-200S Series
    Color

    cyan

    VisualComposite ThicknesshermalImpedance
    @10psi
    (℃-in²/W)
    Construction &
    Compostion
    Ceramic filled silicone rubber
    ***10mils / 0.254 mm0.21
    20mils / 0.508 mm0.27
    Specific Gravity
    2.80 g /ccASTM D297

    30mils / 0.762 mm

    0.39

    40mils / 1.016 mm

    0.43
    Heat Capacity
    1 l /g-KASTM C351

    50mils / 1.270 mm

    0.50

    60mils / 1.524 mm

    0.58

    Hardness
    45 Shore 00ASTM 2240

    70mils / 1.778 mm

    0.65

    80mils / 2.032 mm

    0.76
    Tensile Strength

    55 ps

    ASTM D412

    90mils / 2.286 mm

    0.85

    100mils / 2.540 mm

    0.94
    Continuos Use Temp
    -50 to 200℃

    ***

    110mils / 2.794 mm

    1.00

    120mils / 3.048 mm

    1.07
    Dielectric Breakdown Voltage
    >10000 VACASTM D149

    130mils / 3.302mm

    1.16

    140mils / 3.556 mm

    1.25
    Dielectric Constant
    7.5 MHzASTM D150

    150mils / 3.810 mm

    1.31

    160mils / 4.064 mm

    1.38
    Volume Resistivity
    8X1012Ohm-meterASTM D257

    170mils / 4.318 mm

    1.43

    180mils / 4.572 mm

    1.50
    Fire rating
    94 V0

    equivalent UL

    190mils / 4.826 mm

    1.60

    200mils / 5.080 mm

    1.72
    Thermal conductivity
    2.0W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

    Standard Thicknesses:

    0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
    Consult the factory alternate thickness.

    Standard Sheets Sizes:

    8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
    TIF™ series Individual die cut shapes can be supplied.

    Packaging Details & Lead time

    The packaging of thermal pad
    1.with PET film or foam-for protection
    2. use Paper Card To Separate Each Layer
    3. export carton inside and outside
    4. meet with customers' requirement-customized

    Lead Time :Quantity(Pieces):5000
    Est. Time(days): To be negotiated


    Ziitek Culture

    Quality :
    Do it right the first time, total quality control
    Effectiveness:
    Work precisely and thoroughly for effectiveness
    Service:
    Quick response, On time delivery and Excellent service
    Team work:
    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract

    5.Free sample offer
    6.Quality assurance contract























































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