Sign In | Join Free | My himfr.com
Home > Thermal Gap Pad >

TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules

Dongguan Ziitek Electronic Materials & Technology Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules from wholesalers
     
    Buy cheap TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules from wholesalers
    • Buy cheap TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules from wholesalers
    • Buy cheap TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules from wholesalers
    • Buy cheap TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules from wholesalers
    • Buy cheap TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules from wholesalers

    TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF100-25-11S
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 100000pcs/day
    Delivery Time : 3-5 days
    • Product Details
    • Company Profile

    TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules

    TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules


    Company Profile

    Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.


    The TIF100-25-11S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.



    Features:

    > Good thermal conductive: 2.5W/mK
    > Naturally tacky needing no further adhesive coating
    > Soft and Compressible for low stress applications
    > Available in varies thickness

    > RoHS compliant


    Applications:

    >CPU

    >display card

    >mainboard/mother board

    >notebook

    >power supply

    >Heat pipe thermal solutions

    >Memory Modules

    >Mass storage devices

    >Automotive electronics

    >Set top boxes

    >Audio and video components


    Typical Properties of TIF100-25-11S Series
    Color

    Gray

    VisualComposite ThicknesshermalImpedance
    @10psi
    (℃-in²/W)
    Construction &
    Compostion
    Ceramic filled silicone rubber
    ***10mils / 0.254 mm

    0.48

    20mils / 0.508 mm

    0.56

    Specific Gravity

    2.50 g/cc

    ASTM D297

    30mils / 0.762 mm

    0.71

    40mils / 1.016 mm

    0.80

    Heat Capacity

    1 l/g-K

    ASTM C351

    50mils / 1.270 mm

    0.91

    60mils / 1.524 mm

    0.94

    Hardness
    40 Shore 00ASTM 2240

    70mils / 1.778 mm

    1.05

    80mils / 2.032 mm

    1.15

    Tensile Strength

    40 psi

    ASTM D412

    90mils / 2.286 mm

    1.25

    100mils / 2.540 mm

    1.34

    Continuos Use Temp
    -50 to 200℃

    ***

    110mils / 2.794 mm

    1.43

    120mils / 3.048 mm

    1.52

    Dielectric Breakdown Voltage
    >10000 VACASTM D149

    130mils / 3.302mm

    1.63

    140mils / 3.556 mm

    1.71

    Dielectric Constant
    7.5 MHzASTM D150

    150mils / 3.810 mm

    1.81

    160mils / 4.064 mm

    1.89
    Volume Resistivity
    7.8X10" Ohm-meterASTM D257

    170mils / 4.318 mm

    1.98

    180mils / 4.572 mm

    2.07

    Fire rating
    94 V0

    equivalent UL

    190mils / 4.826 mm

    2.14

    200mils / 5.080 mm

    2.22

    Thermal conductivity
    2.5 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

    Why Choose us ?

    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.


    Standard Thicknesses:
    0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
    Consult the factory alternate thickness.

    Standard Sheets Sizes:
    8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
    TIF™ series Individual die cut shapes can be supplied.

    Peressure Sensitive Adhesive:
    Request adhesive on one side with "A1" suffix.
    Request adhesive on double side with "A2" suffix.

    Reinforcement:
    TIF™ series sheets type can add with fiberglass reinforced.
    Quality TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Dongguan Ziitek Electronic Materials & Technology Ltd.
    *Subject:
    *Message:
    Characters Remaining: (0/3000)