Cache Chips gray 2.5 W/mK No heat sink preheating required phase
changing materials
The TIC™808A is low melting point thermal interface material. At 50℃, The
TIC™800A Series begins to soften and flow, filling the microscopic
irregularities of both the thermal solution and the integrated
circuit package surface, thereby reducing thermal resistance.The
TIC™800A Series is a flexible solid at room temperature and
freestanding without reinforcing components that reduce thermal
performance.
The TIC™808A shows no thermal performance degradation after 1,000 hours@130℃,or
after 500 cycles, from -25℃ to 125℃.The material softens and does
not fully change state resulting in minimal migration (pump out)at
operating temperatures.
TIC800A
Series Datasheet-(E)-REV01.pdf
Features:
> 0.018℃-in² /W thermal resistanceTIC800A
Series Datasheet-(E)-REV01.pdf
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
| Typical Properties of TIC™808A Series |
Product Name | TICTM808A | Testing standards |
Color | Ashy | Visual |
Composite Thickness | 0.008" (0.203mm) | |
Thickness Tolerance | ±0.0008" (±0.019mm) | |
Density | 2.5g/cc | Helium Pycnometer |
Work Temperature | -25℃～125℃ | |
phase transition temperature | 50℃~60℃ | |
Thermal conductivity | 2.5 W/mK | ASTM D5470 (modified) |
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa) | 0.047℃-in²/W | ASTM D5470(modified) |
0.30℃-cm²/W |
Standard Thicknesses:
0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom
liner. TIC™800 series is available in kiss cut an extended pull tab
liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series
products.
Reinforcement:
No reinforcement is necessary.
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates
too much heat affecting its high performance when using. Plus
thermal products can control and manage heat to keep it cool to
some extent.Ziitek provide thermal conductive gap fillers, low
melting point thermal interface materials, thermal conductive
insulators, thermally conductive tapes, electrically & thermally
conductive Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products and so on, for various applications.
