Computer Serves Thermal Phase Changing Materials / Heat Sensitive
Materials
The TIC™808Y Series is low melting point thermal interface material. At 50℃, The
TIC™800Y Series begins to soften and flow, filling the microscopic
irregularities of both the thermal solution and the integrated
circuit package surface, thereby reducing thermal resistance.The
TIC™800Y Series is a flexible solid at room temperature and
freestanding without reinforcing components that reduce thermal
performance.
The TIC™808Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does
not fully change state resulting in minimal migration (pump out)at
operatin g temperatures.
Features
>0.024℃-in² /W thermal resistance
>Naturally tacky at room temperature, no adhesive required
>No heat sink preheating required
Applications
| High Frequency Microprocessors |
| Notebook |
| Computer Serves |
| Memory Modules |
| Cache Chips |
| IGBTs |
| COB Led |
| Desktop PCs |
| CPU |
| Microprocessors |
| Chipsets |
| Graphic Processing Chips |
| Custom application |
| Servers |
| Memory Modules |
| Power semiconductors |
| Power conversion modules |
| LED Power Supply |
| LED Controller |
| LED Lights |
| LED Ceilinglamp |
| Monitoring the Power Box |
| AD-DC Power Adapters |
| Typical Properties of TIC™808Y Series |
| Product Name | TICTM808Y | Testing standards |
| Color | Yellow | Visual |
Composite Thickness
| 0.008"
(0.203mm) | |
| Thickness Tolerance | | |
| Density | 2.2g/cc | Helium Pycnometer |
| Work temperature | -25℃～125℃ | |
| phase transition temperature | 50℃~60℃ | |
| Thermal conductivity | 0.95 W/mK | ASTM D5470 (modified) |
| Thermal lmpedance @ 50 psi(345 KPa) | 0.053℃-in²/W | ASTM D5470 (modified) |
| 0.34℃-cm²/W |
Standard Thicknesses:
0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom
liner. TIC™800 series is available in kiss cut an extended pull tab
liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series
products.
Reinforcement:
No reinforcement is necessary.
Ziitek has independent R&D team. This team is experience,
rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek
thermal conductive materials. With well-equipped testing equipment,
we Ziitek can also do some tests with customers' samples, so we can
find a more suitable Ziitek materials for every customer.
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful
for several months, we can apply other payment term for you, pay
together in every month or 30 days.
