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1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

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1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

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Brand Name :	ziitek
Model Number :	TIS580-12
Certification :	RoHs
Supply Ability :	1000PC/Day
Delivery Time :	2-3 work days

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Product Details
Company Profile

1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

TIS580-12 Series Datasheet-(E)-REV01.pdf

1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

Feature

Good thermal conductivity: 1.2W/mK
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Longer working life
Excellent thermal shock resistance

Application

It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-13, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers

Typical values of TIS^TM580-12
Appearance	White paste	Test Method
Density(g/cm³,25℃)	1.3	ASTM D297
Tack-free time(min,25℃)	≤20	*****
Cure type(1-component)	Dealcoholized	*****
Viscosity@25℃ Brookfield (Uncured)	20K cps	ASTM D1084
Total cure time(d, 25℃)	3-7	*****
Elongation(%)	≥150	ASTM D412
Hardness(Shore A)	25	ASTM D2240
Lap Shear Strength(MPa)	≥2.0	ASTM D1876
Peel Strength(N/mm)	＞3.5	ASTM D1876
Operation temperature(℃)	-60～250	*****
Volume Resistivity(Ω·cm)	2.0×10¹⁶	ASTM D257
Dielectric Strength(KV/mm)	21	ASTM D149
Dielectric Constant (1.2MHz)	2.9	ASTM D150
Thermal Conductivity W/(m·K)	1.2	ASTM D5470
Flame Retardancy	UL94 V-0	E331100

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

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1.2W/MK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured