Silicone rubber sheet ultra soft Thermal Gap Filler grey 3 W/m-K
For LED controller with 55 Shore 00 hardness
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are
extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2
products, CD-ROM ,LCD TV, PDP products, Server Power products, Down
lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power
products and others.
The TIF100-30-02F is not only designed to take advantage of the gap heat transfer,
to fill gaps, complete the heat transfer between heating and
cooling parts, but also played insulation, damping, sealing and so
on, to meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
Features:
> Good thermal conductive: 3.0 W/mK
>RoHS compliant
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> Outstanding thermal performance
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF100-30-02F Series |
Color | gray | Visual | Composite Thickness | hermalImpedance
@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 |
Specific Gravity | 2.01 g /cc | ASTM D297 | 30mils / 0.762 mm | 0.39 |
40mils / 1.016 mm | 0.43 |
Heat Capacity | 1 l /g-K | ASTM C351 | 50mils / 1.270 mm | 0.50 |
60mils / 1.524 mm | 0.58 |
Hardness | 55 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.65 |
80mils / 2.032 mm | 0.76 |
Tensile Strength | 40 ps | ASTM D412 | 90mils / 2.286 mm | 0.85 |
100mils / 2.540 mm | 0.94 |
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.00 |
120mils / 3.048 mm | 1.07 |
Dielectric Breakdown Voltage | >1500～>5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.16 |
140mils / 3.556 mm | 1.25 |
Dielectric Constant | 5.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.31 |
160mils / 4.064 mm | 1.38 |
Volume Resistivity | 6.3X1012Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.43 |
180mils / 4.572 mm | 1.50 |
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.60 |
200mils / 5.080 mm | 1.72 |
Thermal conductivity | 3.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm)
0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm)
0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm)
0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FACTORY INFORMATION:
Factory Size
5,000-10,000 square meters
Factory Country/Region
Building B8, Industry District Ⅱ, Xicheng, Hengli Township,
Dongguan City, Guangdong Province, P.R.China
Annual Output Value
US$1 Million - US$2.5 Million
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
4.兆科文化
