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Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC from wholesalers
     
    Buy cheap Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC from wholesalers
    • Buy cheap Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC from wholesalers
    • Buy cheap Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC from wholesalers

    Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF140FG-05S
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
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    Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

    Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC


    The TIF140FG-05S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.


    Features:


    > Good thermal conductive: 1.5 W/mK
    > Naturally tacky needing no further adhesive coating
    > Soft and Compressible for low stress applications
    > Available in varies thickness

    > RoHS compliant
    > UL recognized
    > Easy release construction


    Applications:


    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > CPU
    > Display card
    > Mainboard/mother board
    > Notebook
    > Power supply
    > Heat pipe thermal solutions
    > Memory Modules
    > Mass storage devices

    Typical Properties of TIF140FG-05S Series
    PropertyValueTest method
    ColorBlueVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Density2.3g/cm³ASTM D297
    Thickness range0.020"(0.5mm)~0.200"(5.0mm)ASTM D374
    Hardness27±5 Shore 00ASTM 2240
    Continuos Use Temp-45 to 200℃******
    Dielectric Breakdown Voltage>5500 VACASTM D149
    Dielectric Constant4.5 MHzASTM D150
    Volume Resistivity(Ohm-cm)1.0X1012ASTM D257
    Fire rating94 V0UL equivalent
    Thermal conductivity1.5W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Standard Sheets Sizes:
    16" x 18"(406mm x 457mm)
    TIF™ series Individual die cut shapes can be supplied.

    Peressure Sensitive Adhesive:
    Request adhesive on one side with "A1" suffix.
    Request adhesive on double side with "A2" suffix.

    Reinforcement:
    TIF™ series sheets type can add with fiberglass reinforced.

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


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