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New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK from wholesalers
     
    Buy cheap New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK from wholesalers
    • Buy cheap New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK from wholesalers
    • Buy cheap New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK from wholesalers

    New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF035-05
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

    New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK

    TIF035-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF035-05 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

    TIF035-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-35 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .


    TIF035-05 Series Datasheet-REV02.pdf


    Application


    >Heat-sink & frame

    >LED backlight module,LED lighting

    >High speed hardware driver

    >Micro heat pipe ,Vihicel enginee controler

    >Telecom industry


    Feature


    >Thermal conductivity: 3.5W/mK

    >Soft, very low compression

    >Operate automaticly


    TIF035-05 Property
    ColorBlueVisual
    Construction & CompositionCeramic filled silicon material**********
    Viscosity2000,000cpsGB/T 10247
    Specific Gravity3.0 g/ccASTM D297
    Thermal conductivity3.5 W/mKISO 22007-2
    Thermal diffusivity1.1073 mm2/sISO 22007-2
    Specific heat capacity3.3 MJ/m3KISO 22007-2
    Continuous Use Temperature-45 ~200°C******
    Dielectric breakdown strength200 V/milASTM D149
    Flame Rating94V0E331100
    Outgassing,%TML0.80%ASTM E595

    Package :


    Product Specification:

    •30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

    We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.


    Company Profile

    Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract

    5.Free sample offer

    6.Quality assurance contract

    Quality New thermal conductive materials 3.0 g/cc Low Compression 94-V0 Silicone Thermally Conductive Putty 3.5W/mK for sale
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