Two Component Silicone Thermal Conductive Adhesive For Gluing Metal
And PCB
TIS™680-10AB Series is a two-component, high thermal conductive, low
temperature cured, long pot life, fire resistant Silica encapsulant
glue. lt is design for potting of capacitors and electrical
devices.Their flexibility and elasticity make them suited to the
coating of the very uneven surfaces.Heat can transmit to the metal
housing or dissipation plate from the separate elements or even the
entire PCB, which in effect enhances the efficiency and life-time
of the heat-generating electronic components.
TIS680-10AB-Specification-sheet.pdf
Feature
>Good thermal conductivity: 1.0W/mK
>Good maneuverability andadhesion performance
>Low shrinkage
>Low viscosity, easy-to-gas emissions
>Good solvent resistance, water resistance
>Longer working hours
>Excellent resistance to thermal shock
Application
> To potting LED Lighting heat spreaderand power- driver.
> Ferrite cements; tip type LED; goodcementation to aromatic
polyester
> Relay sealant; Good adhesion torubber, ceramics, PCB and plastics
> Power transformers and coils; Pottingcapacitors;Potting of small
electricaldevices
> Adhesion to metal glass and plastic;LCD & substrates adhesion;
Coatingand sealant; Coil ; IGBTS;Transformer; Fire retardant
> Optical / medical component adhesive
| Typical Properties of TIS™680-10AB Series |
| Typical Uncured Material |
| TIETM680-10B(Resin) | Mixing ratio (weight ratio)
A:=1 :1 |
| Color | Black |
| Viscosity @25℃ Brookfield | 3500 mPa.s | Viscosity @25℃ Brookfield | 10000 cPs |
| Operating time (@25℃) | 45 mins |
| Shelf life @25℃ in sealed | 6months | specific Gravity | 1.6 g/cc |
| Mixture Color | Black |
| TIE680-10A(Hardener) | Cure Schedule |
| Color | Black | Cure at 25C | 3 hrs |
| Viscosity @25℃ Brookfield | 7000 cPs |
| Shelf life @25℃ in sealed container | 12 months | Cure at 7o°c | 30 mins |
| Cured Properties |
| Hardness @25℃ | 85 Shore D |
| Operating temperature | -40℃ ~160℃ |
| Glass transition temperature Tg | 92℃ |
| Rate of tension | 0.001 |
| Coefficient of thermal expansion, /℃ | 3.0x 10^(-5) |
| Fire resistance uL | 94 V-0 |
| Moisture absorption % wt gain 24 hours water immersion @25℃ | <0.1% |
| Thermal Conductivity | 1.5 W/m-K |
| Dielectric Breakdown Voltage | 300 volts / mil |
| Dielectric Constant@1MHz | 4.2 |
| volume resistivity, ohm-cm @ 25℃ | 3.0x 10^13 |
Product packaging:
1KG A/B for each tank.
5KG A/B each.
10KG A/B each.
Company pfrofile
Ziitek company is a high-tech enterprise which dedicated to the
R&D, manufacture and sales of the thermal interface materials
(TIMs). We have rich experiences in this field which can support
you the latest, most effective and one -step thermal management
solutions. We have many advanced production equipments,full test
equipments and fully automatic coating production lines which can
support the production for high performance thermal silicone pad,
thermal graphite sheet/ film, thermal double-sided tape, thermal
insulation pad, thermal ceramic pad, phase change material, thermal
grease etc. UL94 V-0, SGS and ROHS are compliant.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
