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3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap 3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements from wholesalers
     
    Buy cheap 3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements from wholesalers
    • Buy cheap 3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements from wholesalers
    • Buy cheap 3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements from wholesalers

    3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements

    Ask Lasest Price
    Brand Name : ziitek
    Model Number : TIF3140
    Certification : UL & RoHs
    Price : 0.2USD/PCS to 12USD/PCS
    Supply Ability : 100000PCS/month
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements

    soft thermal pad 27shore00 3.5mmT thermal gap filler pad TIF3140 2.8W conductivity for cooling electronic elements


    The TIF3140 Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. ZiitekTIF3140 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.


    TIF300 Series Datasheet-(E)-REV02-CRM.pdf


    Features


    >Good thermal conductive: 2.8 W/mK
    >Naturally tacky needing no further adhesive coating
    >Soft and Compressible for low stress applications
    >Available in varies thickness

    Applications


    >Cooling components to the chassis of frame
    >High speed mass storage drives
    >Heat Sinking Housing at LED-lit BLU in LCD
    >LED TV and LED-lit lamps
    >RDRAM memory modules
    >Micro heat pipe thermal solutions
    >Automotive engine control units
    >Telecommunication hardware
    >Handheld portable electronics
    >Semiconductor automated test equipment


    Typical Properties of TIF3140 Series
    Color
    GrayVisualComposite Thicknesshermal Impedance
    @10psi
    (℃-in²/W)
    Construction &
    Compostion
    Ceramic filled silicone rubber
    ***10mils / 0.254 mm0.42
    20mils / 0.508 mm0.49
    Specific Gravity
    3.05 g/ccASTM D29730mils / 0.762 mm0.59
    40mils / 1.016 mm0.66
    Heat Capacity
    1 l/g-KASTM C35150mils / 1.270 mm0.77
    60mils / 1.524 mm0.81
    Hardness
    27 Shore 00ASTM 224070mils / 1.778 mm0.89
    80mils / 2.032 mm0.97
    Tensile Strength35 psiASTM D41290mils / 2.286 mm1.06
    100mils / 2.540 mm1.14
    Continuos Use Temp
    -40 to 160℃***110mils / 2.794 mm1.22
    120mils / 3.048 mm1.33
    Outgassing(TML)
    0.45%ASTM E595130mils / 3.302mm1.40
    140mils / 3.556 mm1.48
    Dielectric Constant
    6.5 MHzASTM D150150mils / 3.810 mm1.59
    160mils / 4.064 mm1.67
    Volume Resistivity
    4.2X1013
    Ohm-meter
    ASTM D257170mils / 4.318 mm1.76
    180mils / 4.572 mm1.85
    Fire rating
    94 V0equivalent UL190mils / 4.826 mm1.90
    200mils / 5.080 mm1.99
    Thermal conductivity
    2.8 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

    Standard Thicknesses:
    0.140" (3.56mm)
    Consult the factory alternate thickness.

    Standard Sheets Sizes:
    8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
    TIF™ series Individual die cut shapes can be supplied.

    Peressure Sensitive Adhesive:
    Request adhesive on one side with "A1" suffix.
    Request adhesive on double side with "A2" suffix.

    Reinforcement:
    TIF™ series sheets type can add with fiberglass reinforced.

    Quality:
    Do it Right the First Time, Total Quality Control.

    Effectiveness:
    Work Precisely and Thoroughly for Effectiveness.

    Service:
    Quick Response, On Time Delivery and Excellent Service.

    TeamWord:
    Teamwork that Integrates Sales, Marketing, Engineering, R&D, Manufacturing, Logistics, all other Supporting and Services to Satisfy Customer Needs.


    FAQ
    Q: What's the thermal conductivity test method given on the data sheet ?

    A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


    Q:How can we get detailed price list?

    A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

    Quality 3.5mm T Thermal Gap Filler / Thermal Conductive Pad TIF3140 For Cooling Electronic Elements for sale
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