Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with
0.024℃-in² / W
The TIC™803Y Series is low melting point thermal interface material. At 50℃, The
TIC™800Y Series begins to soften and flow, filling the microscopic
irregularities of both the thermal solution and the integrated
circuit package surface, thereby reducing thermal resistance.The
TIC™800Y Series is a flexible solid at room temperature and
freestanding without reinforcing components that reduce thermal
performance.
The TIC™803Y Series shows no thermal performance degradation after 1,000 hours@130℃,or
after 500 cycles, from -25℃ to 125℃.The material softens and does
not fully change state resulting in minimal migration (pump out)at
operating temperatures.
Features:
| No heat sink preheating required |
| Low thermal resistance |
| Ease of use for high volume manufacturing |
| High thixotropic index |
| Dry to the touch for pre-apply applications |
| High thermal reliability, minimal pump out |
| Re-flow compatible |
| Cost Effective |
| Used where electrical isolation is not required |
| Low volatility – less than 1% |
| Easy to handle in the manufacturing environment |
| Flows but doesn’t run like grease |
| Available in custom die-cut shapes, kiss-cut on rolls |
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
> Telecommunication
| Typical Properties of TIC™800Y Series |
| Product Name | TICTM803Y | TICTM805Y | TICTM808Y | TICTM810Y | Testing standards |
| Color | Yellow | Yellow | Yellow | Yellow | Visual |
Composite Thickness
| 0.003"
(0.076mm) | 0.005"
(0.126mm) | 0.008"
(0.203mm) | 0.010"
(0.254mm) | |
| Thickness Tolerance | ±0.0006"
(±0.016mm) | ±0.0008"
(±0.019mm) | ±0.0008"
(±0.019mm) | ±0.0012"
(±0.030mm) | |
| Density | 2.2g/cc | Helium Pycnometer |
| Work temperature | -25℃～125℃ | |
| phase transition temperature | 50℃~60℃ | |
| Thermal conductivity | 0.95 W/mK | ASTM D5470 (modified) |
| Thermal lmpedance @ 50 psi(345 KPa) | 0.021℃-in²/W | 0.024℃-in²/W | 0.053℃-in²/W | 0.080℃-in²/W | ASTM D5470 (modified) |
| 0.14℃-cm²/W | 0.15℃-cm²/W | 0.34℃-cm²/W | 0.52℃-cm²/W |
Standard Thicknesses:
0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom
liner. TIC™800 series is available in kiss cut an extended pull tab
liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series
products.
Reinforcement:
No reinforcement is necessary.
