Low Melting Materials Customized High Quality Phase Change Material
For Notebook
TIC™812G series is low melting point thermal interface material. At 50℃,
TIC™800G series begins to soften and flow, filling the microscopic
irregularities of both the thermal solution and the integrated
circuit package surface, thereby reducing thermal resistance.
TIC™812G series is a flexible solid at room temperature and
freestanding without reinforcing components that reduce thermal
performance.
TIC™812G Series shows no thermal performance degradation after
1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The
material softens and does not fully change state resulting in
minimal migration (pump out)at operating temperatures.
TIC800G
Series Datasheet-(E)-REV01.pdf
Applications Include:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Features:
For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required
| Typical Properties of TICTM812G Series |
| Product Name | TICTM805G | TICTM808G | TICTM810G | TICTM812G | Test Method |
| Color | Gray | Gray | Gray | Gray | Visual |
| Thickness | 0.005"
(0.126mm) | 0.008"
(0.203mm) | 0.010"
(0.254mm) | 0.012"
(0.305mm) | |
| Thickness Tolerance | ±0.0008''
(±0.019mm) | ±0.0008''
(±0.019mm) | ±0.0012''
(±0.030mm) | ±0.0012''
(±0.030mm) | |
| Density | 2.6g/cc | Helium Pycnometer |
| Temperature range | -25℃～125℃ | |
| Phase Change Softening Temperature | 50℃~60℃ | |
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) |
| Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in²/W | 0.020℃-in²/W | 0.038℃-in²/W | 0.058℃-in²/W | ASTM D5470 (modified) |
| 0.09℃-cm²/W | 0.13℃-cm²/W | 0.25℃-cm²/W | 0.37℃-cm²/W |
Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom
liner. TIC800™ series is available in kiss cut an extended pull tab
liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series
products.
Reinforcement:
No reinforcement is necessary.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With professional R&D capabilities and over 18 year experiences
in thermal interface material industry, Ziitek company own many
unique formulations which are our core technologies and advantages.
Our goal is to provide quality & competitive products to our
customers worldwide aiming for long-term business cooperation.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it
is 7-10 work days if the goods are not in stock, it is according to
quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
