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Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness

    Buy cheap Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness from wholesalers
     
    Buy cheap Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness from wholesalers
    • Buy cheap Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness from wholesalers
    • Buy cheap Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness from wholesalers
    • Buy cheap Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness from wholesalers
    • Buy cheap Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness from wholesalers

    Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness

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    Brand Name : Ziitek
    Model Number : TIC™808G series
    Certification : RoHs
    Price : negotiation
    Supply Ability : 100000pcs/day
    Delivery Time : 3-5 work days
    • Product Details
    • Company Profile

    Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness

    Thermal Interface Phase Changing Materials For IGBTs 0.127 - 0.25mm Thickness


    Company Profile

    Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


    TIC™800G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

    TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

    TIC800G Series Datasheet-(E)-REV01.pdf


    Applications Include:


    > High Frequency Microprocessors
    > Notebook and Desktop PCs
    > Computer Serves
    > Memory Modules
    > Cache Chips
    > IGBTs


    Features:


    For Lowest Thermal Resistance :
    > 0.014℃-in² /W thermal resistance
    > Naturally tacky at room temperature,
    no adhesive required
    > No heat sink preheating required


    Typical Properties of TICTM800G Series
    Product NameTICTM805GTICTM808GTICTM810GTICTM812GTest Method
    ColorGrayGrayGrayGrayVisual
    Thickness0.005"
    (0.126mm)
    0.008"
    (0.203mm)
    0.010"
    (0.254mm)
    0.012"
    (0.305mm)
     
    Thickness Tolerance±0.0008''
    (±0.019mm)
    ±0.0008''
    (±0.019mm)
    ±0.0012''
    (±0.030mm)
    ±0.0012''
    (±0.030mm)
     
    Density2.6g/ccHelium Pycnometer
    Temperature range-25℃~125℃ 
    Phase Change Softening Temperature50℃~60℃ 
    Thermal Conductivity5.0 W/mKASTM D5470 (modified)
    Thermal Impedance @ 50 psi(345 KPa)0.014℃-in²/W0.020℃-in²/W0.038℃-in²/W0.058℃-in²/WASTM D5470 (modified)
    0.09℃-cm²/W0.13℃-cm²/W0.25℃-cm²/W0.37℃-cm²/W

    Standard Thicknesses:


    0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
    Consult the factory alternate thickness.


    Standard Sizes:


    10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
    TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.

    Peressure Sensitive Adhesive:


    Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

    Reinforcement:
    No reinforcement is necessary.



    Advantage


    Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

    They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.


    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract

    5.Free sample offer

    6.Quality assurance contract


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