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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK

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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK

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Brand Name :	Ziitek
Model Number :	TIA810
Certification :	RoHs
Supply Ability :	1000SQM/Day
Delivery Time :	2-3Work day

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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK

The TIA™810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

Features

Thermal Conductivity 0.9W/mK.

High bond strength to a variety of surfaces

Double sided pressure sensitive adhesive tape.

High performance, thermally conductive acrylic adhesive

allow for good conformability to irregular surfaces and good electrical isolation

Easy Application

Eliminates need for external hardware (screws, clips, etc.)

Available with easy release tabs

Applications

Mount heat sink onto BGA graphic processor or drive processor.

Mount heat spreader onto power converter PCB or onto motor control PCB

Can be used instead of heat cure adhesive,screw mounting or clip mounting

Heat sink onto BGA graphic processor

Heat sink to computer processor

Heat sink onto drive processor

LED Power Supply

LED Controller

LED Lights

LED Ceilinglamp

Monitoring the Power Box

AD-DC Power Adapters

Rainproof LED Power Supply

Waterproof LED Power Supply

Piranha wroof and common lED module

LED module for Channelletters

SMD LED module

LED Flesible strip, LED bar

LED PanelLight

Typical Properties of TIA™800 Series
Product Name	TIA™806	TIA™808	TIA™810	TIA™812	TIA™818	Test Method
Color	White	White	White	White	White	Visual
Construction &Compostion	Ceramic filled silicone elastomer					***
Composite Thickness	0.006"/0.152mm	0.008"/0.203mm	0.010"/0.254mm	0.012"/0.304mm	0.018"/0.457mm	ASTM D751
Specific Gravity	2.2 g/cc					ASTM D297
Specific Gravity	1 l/g-K					ASTM C351
Hardness	50 Shore A					ASTM 2240
Tensile Strength	450 psi	>600 psi	>600 psi	>600 psi	>600 psi	ASTM D412
Continuous Use Temp	(-58 to 356℉) / (-50 to 180℃)					***
Electrical
Dielectric Breakdown Voltage	>1500 VAC	>3500 VAC	>5000 VAC	>5000 VAC	>5000 VAC	ASTM D149
Dielectric Constant	5.5 MHz					ASTM D150
Volume Resistivity	5.0X10" Ohm-meter					ASTM D257
Flame Rating	94 V0					equivalent UL
Thermal
Thermal Conductivity	0.9 W/m-K					ASTM D5470
Thermal lmpedance @50psi	0.21℃-in²/W	0.35℃-in²/W	0.82℃-in²/W	1.23℃-in²/W	1.83℃-in²/W	ASTM D5471

Standard Thicknesses:

0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.

Standard Sizes:

10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.

Reinforcement:

TIA™800 Series sheets are fiberglass reinforced.

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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK

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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK