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Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape from wholesalers
     
    Buy cheap Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape from wholesalers
    • Buy cheap Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape from wholesalers
    • Buy cheap Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape from wholesalers
    • Buy cheap Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape from wholesalers
    • Buy cheap Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape from wholesalers

    Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape

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    Brand Name : Ziitek
    Model Number : TIA815
    Certification : RoHs
    Supply Ability : 1000SQM/Day
    Delivery Time : 2-3Work day
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    Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape

    Heat Sink Thermal Conductive Adhesive Tape , 0.8 W / mK Glass Fiber Backing Heat Resistant Tape


    The TIA™815 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.


    TIA800 Series Datasheet-(E)-REV01.pdf


    Features


    Thermal Conductivity 0.9W/mK.
    High bond strength to a variety of surfaces
    Double sided pressure sensitive adhesive tape.
    High performance, thermally conductive acrylic adhesive
    allow for good conformability to irregular surfaces and good electrical isolation
    Easy Application
    Eliminates need for external hardware (screws, clips, etc.)
    Available with easy release tabs

    Applications


    Mount heat sink onto BGA graphic processor or drive processor.
    Mount heat spreader onto power converter PCB or onto motor control PCB
    Can be used instead of heat cure adhesive,screw mounting or clip mounting
    Heat sink onto BGA graphic processor
    Heat sink to computer processor
    Heat sink onto drive processor
    LED Power Supply
    LED Controller
    LED Lights
    LED Ceilinglamp
    Monitoring the Power Box
    AD-DC Power Adapters
    Rainproof LED Power Supply
    Waterproof LED Power Supply
    Piranha wroof and common lED module
    LED module for Channelletters
    SMD LED module
    LED Flesible strip, LED bar
    LED PanelLight

    Typical Properties of TIA™800 Series
    Product NameTIA™815Test Method
    ColorWhiteVisual
    ConstructionCeramic filled silicone elastomer***
    &Compostion
    Composite Thickness0.015"/0.381mmASTM D751
    Specific Gravity2.4 g/ccASTM D297
    Specific Gravity1 l/g-KASTM C351
    Hardness50 Shore AASTM 2240
    Tensile Strength>600 psiASTM D412
    Continuous Use Temp(-58 to 356℉) / (-50 to 180℃)***
    Electrical
    Dielectric Breakdown Voltage>5000 VACASTM D149
    Dielectric Constant5.5 MHzASTM D150
    Volume Resistivity5.0X10" Ohm-meterASTM D257
    Flame Rating94 V0equivalent UL
    Thermal
    Thermal Conductivity0.9 W/m-KASTM D5470
    Thermal lmpedance @50psi1.23℃-in²/WASTM D5471
    Standard Thicknesses:

    0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
    Consult the factory alternate thickness.

    Standard Sizes:

    10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
    Individual die cut shapes can be supplied.

    Reinforcement:

    TIA™800 Series sheets are fiberglass reinforced.
    Quality Heat Sink Thermal Conductive Adhesive Tape , 0.9 W / mK Glass Fiber Backing Heat Resistant Tape for sale
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