Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone
Pads For Ssd Cpu Gpu Led Ic Chipset Cooling
The TIF100-15-11S thermally conductive interface materials are applied to fill the
air gaps between the heating elements and the heat dissipation fins
or the metal base. Their flexibility and elasticity make them
suited to the coating of the very uneven surfaces. Heat can
transmit to the metal housing or dissipation plate from the
separate elements or even the entire PCB, which in effect enhances
the efficiency and life-time of the heat-generating electronic
components.
Features:
> Good thermal conductive: 1.5 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
> RoHS compliant
> UL recognized
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
| Typical Properties of TIF100-15-11S Series |
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ******* |
| Specific Gravity | 2.3 g/cc | ASTM D297 |
| Thickness range | 0.020"-0.200" | ASTM C351 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Operating Temp | -45 ~200℃ | ******* |
| Outgassing(TML) | 0.35% | ASTM E595 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 1.5 W/mK | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Standard Sheets Sizes:8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Company profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was
established in 2006. Is a high-tech enterprise specializing in the
research, development, production and sales of thermal interface
materials. We mainly produce: heat-conducting joint filler, low
melting point thermal interface materials, heat-conducting
insulator, heat-conducting adhesive tape, heat-conducting interface
pad and heat-conducting grease, heat-conducting plastic, silicone
rubber, silicone rubber foam, etc. We adhere to the business
philosophy of "survival by quality, development by quality", and
continue to provide the most efficient and best service for new and
old customers with excellent quality in the spirit of rigor,
pragmatism and innovation.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team,
engineering team, R&D team, Manufacturing team, logistics team.
All is for supporting and servicing a satisfy service for
customers.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
