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Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉ from wholesalers
     
    Buy cheap Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉ from wholesalers
    • Buy cheap Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉ from wholesalers
    • Buy cheap Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉ from wholesalers
    • Buy cheap Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉ from wholesalers
    • Buy cheap Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉ from wholesalers

    Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉

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    Brand Name : Ziitek
    Model Number : TIG780-20
    Certification : RoHs
    Supply Ability : 100KG/Days
    Delivery Time : 3-5 work days
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    • Company Profile

    Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉

    Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK -49℉ - 392℉

    The TIG™780-20 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the heat dissipation fins. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance. Consequently, the heat dissipation efficiency is far superior to that offered by others.

    Features
    Low thermal resistance
    One component paste like interface material, never dry
    Thermal compound formulated to maximize the heat transfer
    Outstanding electrical insulation properties and will not harden on long exposure to elevated temperatures
    Non-toxic and environmentally safe
    Silicone-based materials conduct heat between a hot component and a heat sink or enclosure
    Fills interface variable tolerances in electronics assemblies and heat sink applications
    Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
    Thermally stable and require virtually no compressive force to deform under typical assembly pressures
    Supports high power applications requiring material with minimum bond line thickness and high conductivity
    Ideal for rework and field repair situations
    Low bleed and evaporation


    Applications
    Semiconductor cases and heat sinks
    Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices
    CPUs and GPUs
    Automatic dispensing and screen-printing
    Mobile, desktop
    Engine and transmission control modules
    Memory modules
    Power conversion equipment
    Power supplies and UPS
    Power semiconductors
    Custom ASICS Chips
    Integrated Gate Bipolar Transistors (IGBT)
    Between any heat generating semiconductor and heat sink
    Custom power modules
    Telecommunications and automotive electronics
    LED Power Supply
    LED Controller
    LED Lights
    LED Ceilinglamp

    Typical Properties of TIG™780-20 Series

    ProductName
    TIGTM780-20
    Test Method
    Color
    White paste
    Visual
    Construction &
    Compostion
    Metal oxide filled silicone oil
    Viscosity
    1800K cps @.25℃
    Brookfield RVF,#7

    Specific Gravity

    2.5 g/cm3
    Continuous Use Temp
    -49℉ to 392℉ / -45℃ to 200℃
    *****
    Evaporation
    0.15% / 200℃@24hrs
    *****
    Thermal Conductivity
    2.0 W/mK
    ASTM D5470
    Thermal lmpedance
    0.05℃-in²/W @ 50 psi(344 KPa)
    ASTM D5469

    Package:
    TIG™780 series is available in 1kg (pint container), 3kg (quart container), and 10kg (gallon container) or custom packaged in syringes for automated applications.


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