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Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃ from wholesalers
     
    Buy cheap Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃ from wholesalers
    • Buy cheap Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃ from wholesalers
    • Buy cheap Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃ from wholesalers
    • Buy cheap Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃ from wholesalers
    • Buy cheap Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃ from wholesalers

    Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃

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    Brand Name : ZIITEK
    Model Number : TIF150-30-19S
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃

    High Dielectric Strength Thermal Conductive Pad For Telecommunication Hardware


    The TIF150-30-19S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.



    Features:


    > Good thermal conductive: 3.0 W/mK
    > Naturally tacky needing no further adhesive coating
    > Soft and Compressible for low stress applications
    > Available in varies thickness


    Applications:


    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)


    Typical Properties of TIF150-30-19S Series
    Color

    Yellow

    VisualComposite ThicknesshermalImpedance
    @10psi
    (℃-in²/W)
    Construction &
    Compostion
    Ceramic filled silicone rubber
    ***10mils / 0.254 mm

    0.55

    20mils / 0.508 mm

    0.82

    Specific Gravity

    2.10 g/cc

    ASTM D297

    30mils / 0.762 mm

    1.01

    40mils / 1.016 mm

    1.11

    Heat Capacity

    1 l/g-K

    ASTM C351

    50mils / 1.270 mm

    1.27

    60mils / 1.524 mm

    1.45

    Hardness
    27/35/45/60
    (Shore 00)
    ASTM 2240

    70mils / 1.778 mm

    1.61

    80mils / 2.032 mm

    1.77

    Tensile Strength

    40 psi

    ASTM D412

    90mils / 2.286 mm

    1.91

    100mils / 2.540 mm

    2.05

    Continuos Use Temp

    -50 to 200℃

    ***

    110mils / 2.794 mm

    2.16

    120mils / 3.048 mm

    2.29

    Dielectric Breakdown Voltage
    >1500~>5500 VACASTM D149

    130mils / 3.302mm

    2.44

    140mils / 3.556 mm

    2.56

    Dielectric Constant
    5.5 MHzASTM D150

    150mils / 3.810 mm

    2.67

    160mils / 4.064 mm

    2.77

    Volume Resistivity
    4.0X10"
    Ohm-meter
    ASTM D257

    170mils / 4.318 mm

    2.89

    180mils / 4.572 mm

    2.98

    Fire rating
    94 V0

    equivalent UL

    190mils / 4.826 mm

    3.05

    200mils / 5.080 mm

    3.14

    Thermal conductivity
    3.0 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
    Standard Thicknesses:
    0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
    Consult the factory alternate thickness.

    Standard Sheets Sizes:

    8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
    TIF™ series Individual die cut shapes can be supplied.

    Peressure Sensitive Adhesive:

    Request adhesive on one side with "A1" suffix.
    Request adhesive on double side with "A2" suffix.

    Reinforcement:

    TIF™ series sheets type can add with fiberglass reinforced.

    Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

    They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.


    Q: Do you offer free samples ?

    A: Yes, we are willing to offer free sample.


    Q: What is your terms of payment ?

    A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.


    Quality Yellow High Dielectric Strength Thermal Conductive Pad 3.0W/mK For Telecommunication Hardware silicone pad -50 to 200℃ for sale
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