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Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk from wholesalers
     
    Buy cheap Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk from wholesalers
    • Buy cheap Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk from wholesalers
    • Buy cheap Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk from wholesalers
    • Buy cheap Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk from wholesalers
    • Buy cheap Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk from wholesalers

    Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF120-20-07U
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk

    Ultra Soft Low Thermal Conductivity Materials PAD Light Green 3.5 MHz Dielectric Constant


    The TIF120-20-07U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


    TIF100-07U Datasheet-REV02.pdf


    Features:


    > Good thermal conductive: 1.5 W/mK

    > Thickness:0.5 mmT

    > Hardness:27 SHORE 00
    > Naturally tacky needing no further adhesive coating
    > Soft and Compressible for low stress applications
    > Available in varies thickness


    Applications:


    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Automotive engine control units
    > Telecommunication hardware
    > Handheld portable electronics
    > Semiconductor automated test equipment (ATE)



    Typical Properties of TIF120-20-07U Series
    Color

    Light Green

    VisualComposite ThicknesshermalImpedance
    @10psi
    (℃-in²/W)
    Construction &
    Compostion
    Ceramic filled silicone rubber
    ***10mils / 0.254 mm

    0.55

    20mils / 0.508 mm

    0.82

    Specific Gravity

    2.10 g/cc

    ASTM D297

    30mils / 0.762 mm

    1.01

    40mils / 1.016 mm

    1.11

    Heat Capacity

    1 l/g-K

    ASTM C351

    50mils / 1.270 mm

    1.27

    60mils / 1.524 mm

    1.45

    Hardness
    27 Shore 00ASTM 2240

    70mils / 1.778 mm

    1.61

    80mils / 2.032 mm

    1.77

    Tensile Strength

    40 psi

    ASTM D412

    90mils / 2.286 mm

    1.91

    100mils / 2.540 mm

    2.05

    Continuos Use Temp

    -40 to 160℃

    ***

    110mils / 2.794 mm

    2.16

    120mils / 3.048 mm

    2.29

    Dielectric Breakdown Voltage
    >5500 VACASTM D149

    130mils / 3.302mm

    2.44

    140mils / 3.556 mm

    2.56

    Dielectric Constant
    3.5 MHzASTM D150

    150mils / 3.810 mm

    2.67

    160mils / 4.064 mm

    2.77

    Volume Resistivity
    4.0X1012
    Ohm-meter
    ASTM D257

    170mils / 4.318 mm

    2.89

    180mils / 4.572 mm

    2.98

    Fire rating
    94 V0

    equivalent UL

    190mils / 4.826 mm

    3.05

    200mils / 5.080 mm

    3.14

    Thermal conductivity
    1.5 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
    Standard Thicknesses:

    0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
    Consult the factory alternate thickness.

    Standard Sheets Sizes:

    8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
    TIF™ series Individual die cut shapes can be supplied.

    Peressure Sensitive Adhesive:

    Request adhesive on one side with "A1" suffix.
    Request adhesive on double side with "A2" suffix.

    Reinforcement:

    TIF™ series sheets type can add with fiberglass reinforced.
    FAQ
    Q: What's the thermal conductivity test method given on the data sheet ?

    A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


    Q:How can we get detailed price list?

    A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

    Quality Ultra Soft Low Thermal Conductivity PAD TIF120-20-07U Light Green 3.5 MHz Dielectric Constant 2.0W/mk for sale
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