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2.5mmt Thermal Gap Pad Easy Release Construction For Smd Led Module

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2.5mmt Thermal Gap Pad Easy Release Construction For Smd Led Module

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Brand Name :	ZIITEK
Model Number :	TIF1100-30-02US
Certification :	UL and RoHs
Price :	negotiation
Supply Ability :	100000pcs/day
Delivery Time :	3-5 work days

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Product Details
Company Profile

2.5mmt Thermal Gap Pad Easy Release Construction For Smd Led Module

2.5mmT Easy Release Construction Thermal Gap Pad For SMD LED module,-40 to 160℃

The TIF1100-30-02US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF100-30-02US-Datasheet-REV02.pdf

Features

> Good thermal conductive: 3.0 W/mK

>Thickness:2.5mmT

>hardness:20 shore 00

>Colour: Gray

>Moldability for complex parts

>Outstanding thermal performance

>High tack surface reduces contact resistance

Applications

>Waterproof LED Power

>SMD LED module

>LED Flesible strip, LED bar

>LED PanelLight

>LED floor light

>Routers

Typical Properties of TIF1100-30-02US Series
Color	Gray	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	2.9 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	2.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	20 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.35%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	3.8 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	3.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ:

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

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