2.5mmT Moldability for Complex Parts Gray Conductive Pads for CPU
The TIF7100M is not only designed to take advantage of the gap heat transfer, to
fill gaps, complete the heat transfer between heating and cooling
parts, but also played insulation, damping, sealing and so on, to
meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
TIF700M-Series-Datasheet.pdf
Features
> Good thermal conductive: 6.0 W/mK
> Thickness: 2.5mmT
> hardness:50 shore 00
> Colour: Grey
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
Applications
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>Semiconductor automated test equipment (ATE)
>CPU
>display card
Typical Properties of TIF7100M Series |
Color | Grey | Visual | Composite Thickness | Thermal Impedance@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 |
Specific gravity | 3.25 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 |
| Thickness | 2.5mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 |
Hardness | 50 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 |
| Thermal conductivity | 6.0W/mk | ISO22007-2.2 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 |
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 |
Dielectric Constant | 4.2 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 |
Volume Resistivity | 5.2X1013
Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 |
Fire rating | 94 V0 | equivalent
UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 |
Thermal conductivity |
6.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal
interface materials, thermal conductive insulators, thermally
conductive tapes, electrically & thermally conductive Interface
pads and thermal grease,Thermal Conductive plastic,Silicone
Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
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