Good Performance 3.0W/mk Thermally Conductive Gel For Mainboard and
Mother Board
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the
R&D, manufacture and sales of the thermal interface materials
(TIMs). We have rich experiences in this field which can support
you the latest, most effective and one -step thermal management
solutions. We have many advanced production equipments,full test
equipments and fully automatic coating production lines which can
support the production for high performance thermal silicone pad,
thermal graphite sheet/ film, thermal double-sided tape, thermal
insulation pad, thermal ceramic pad, phase change material, thermal
grease etc. UL94 V-0, SGS and ROHS are compliant.
Ziitek TIF030AB-05S is a highly thermal conductive, liquid gap filling material. It is
provide with two-component and different temperature curing system.
The product was supplied as highly thermal conductive, soft and
elastomer for coupling on electrical devices modul. Heat can
transmit to the metal housing or dissipation plate from the
separate elements or even the entire PCB, which in effect enhances
the efficiency and life-time of the heat-generating electronic
components. It is liquid approach offer variety of thickness,
replacing individual die-cut and specific pad thickness. Different
from grease, the cured product is dry and can be touch. It can
intented for use in thermal applications.
Features:
> Good thermal conductivity: 3 W/mk
> Two-part formulation for easy storage
> Excellent low and high temperature mechanical and chemical
stability
> Ultra-confirming low-streee interface application
> Ambient or accelerated cure schedules
> Optimized shear thinning characteristics for ease of
dispensing
Applications:
> Computer and peripherals
> Telecommunications
> Automotive electronics
> Thermally conductive vibration dampening
> Heat sink any heat generating semiconductor
| Typical Properties of TIF030AB-05S Series |
| Uncured Material Properties |
| Property | Numerical | Test Method |
| Color/Part A | White | Visual |
| Color/Part B | Blue | Visual |
| Part A Viscosity (mPa.s) | 900,000 cps | GB/T 10247 |
| Part B Viscosity (mPa.s) | 1,500,000 cps | GB/T 10247 |
| Flow Rate (g/min) | 25 | Ziitek Test Method |
| Density | 3.1g/cc | ASTM D297 |
| Bond Line thickness (mm) | 0.2 | Ziitek Test Method |
| Thermal resistance @10psi(℃•in2/W) | 0.75 | ASTM D5470 |
| Thermal resistance @50psi(℃•in2/W) | 0.45 | ASTM D5470 |
| Mix Ratio | 0.042361111 | ****** |
| Shelf Life | 12 months | ****** |
| Cure Schedule |
| Pot Life @25℃ | 30min | Ziitek Test Method |
| Cure @25℃ | 16hrs | Ziitek Test Method |
| Cure @70℃ | 30min | Ziitek Test Method |
| Cure Material Properties |
| Color | Blue | Visual |
| Hardness | 65 shore00 | ASTM D2240 |
| Continuous Use Temp | -45~200℃ | Ziitek Test Method |
| Break Voltage | ≥5500 | ASTM D149 |
| Flame Rating | 94V0 | UL E331100 |
| Thermal Conductivity | 3.0W/Mk | ASTM D5470 |
Product packing details:
50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing
applications. Please contact us for confirming.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries
in English of course.
Standard Export Carton Or Marked With Customer's Information Or
Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if
you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory
solution.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it
is 7-10 work days if the goods are not in stock, it is according to
quantity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat
dissipation. Please tell us your detailed applications and the
power, so we can recommend most suitable thermal conductive
materials.
