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CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

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Brand Name :	ZIITEK
Model Number :	TIF760PUS thermal pad
Certification :	UL
Price :	negotiation
Supply Ability :	100000pcs/day
Delivery Time :	3-5 work days

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Product Details
Company Profile

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

CPU high thermal conductivity die cut silicon thermal pad

Ziitek TIF760HP is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF700PUS-data sheet.pdf

Features

> Good thermal conductive: 7.5 W/mK

> Thickness: 1.5 mmT

> hardness:20

> Colour: gray

> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance

Applications

> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

Typical Properties of TIF760HP Series
Color	Blue	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.2 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	1.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	20	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Thermal conductivity	7.5W/mk	ASTMD5470	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	≥6000 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.5MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	≥ 3.5X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	7.5 W/m-K	GB-T32064	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

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