2.0mmT grey high cost-effective 1.8W/mK, 20 shore00 thermal
conductive gap pad for Set top boxes
The TIF580-18-11US is not only designed to take advantage of the gap heat transfer, to
fill gaps, complete the heat transfer between heating and cooling
parts, but also played insulation, damping, sealing and so on, to
meet the equipment miniaturization and ultra-thin design
Requirements, which is a highly technology and use, and the
thickness of the wide range of applications, is also an excellent
thermal conductivity filler material.
TIF500-18-11US Datasheet-REV02.pdf
Company Profile
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
Features:
>Thickness:2.0mmT
> Good thermal conductive: 1.8W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> Electrically isolating
> High durability
Applications:
>notebook
>power supply
>Heat pipe thermal solutions
>Memory Modules
>CD-Rom, DVD-Rom cooling
>LED Power Supply
>LED Controller
>LED Ceilinglamp
>cooling components to the chassis of frame
>High speed mass storage drives
Typical Properties of TIF™580-18-11US |
| Color | Grey | Visual | Composite Thickness | hermalImpedance
@10psi
(℃-in²/W) |
Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.21 |
| 20mils / 0.508 mm | 0.27 |
| Specific Gravity | 2.8 g /cc | ASTM D297 | 30mils / 0.762 mm | 0.39 |
40mils / 1.016 mm | 0.43 |
| Heat Capacity | 1 l /g-K | ASTM C351 | 50mils / 1.270 mm | 0.50 |
60mils / 1.524 mm | 0.58 |
| Hardness | 20 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.65 |
80mils / 2.032 mm | 0.76 |
| Tensile Strength | 55 ps | ASTM D412 | 90mils / 2.286 mm | 0.85 |
100mils / 2.540 mm | 0.94 |
| Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 1.00 |
120mils / 3.048 mm | 1.07 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.16 |
140mils / 3.556 mm | 1.25 |
| Dielectric Constant | 4.2 MHz | ASTM D150 | 150mils / 3.810 mm | 1.31 |
160mils / 4.064 mm | 1.38 |
| Volume Resistivity | 1.0X1012 Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.43 |
180mils / 4.572 mm | 1.50 |
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.60 |
200mils / 5.080 mm | 1.72 |
| Thermal conductivity | 1.8 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Thickness
| 2.0mmT | *** | | |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
