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CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction from wholesalers
     
    Buy cheap CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction from wholesalers
    • Buy cheap CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction from wholesalers
    • Buy cheap CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction from wholesalers

    CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF760QE
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

    High-Density conductive thermal pad For CPU


    The TIF760QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF760QE is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.


    Features:


    > Good thermal conductive:8.0 W/mK

    > Naturally tacky needing no further adhesive coating
    > Soft and Compressible for low stress applications
    > Available in varies thickness

    > Outstanding thermal performance
    > High tack surface reduces contact resistance
    > RoHS compliant
    > UL recognized



    Applications:


    > Cooling components to the chassis of frame
    > High speed mass storage drives
    > Heat Sinking Housing at LED-lit BLU in LCD
    > LED TV and LED-lit lamps
    > RDRAM memory modules
    > Micro heat pipe thermal solutions
    > Semiconductor automated test equipment (ATE)
    > CPU
    > Display card
    > Mainboard/mother board


    Typical Properties of TIF760QE Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.5g/ccASTM D297
    thickness1.5mmASTM D374
    Hardness35±10 (Shore 00)ASTM 2240
    Continuos Use Temp-45 to 200℃******
    Dielectric Breakdown Voltage>5500 VACASTM D149
    Dielectric Constant5.5MHzASTM D150
    Volume Resistivity1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity8.0W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Standard Sheets Sizes:
    8" x 16"(203mm x 406mm)
    TIF™ series Individual die cut shapes can be supplied.
    Company Profile

    Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!


    Certifications:

    ISO9001:2015

    ISO14001: 2004 IATF16949:2016

    IECQ QC 080000:2017

    UL


    Why Choose us ?


    1.Our value message is'' Do it right the First time, total quality control''.

    2.Our core competencies is thermal conductive interface materials

    3.Competitive advantage products.

    4.Condidentiality agreement Bussiness Secrect Contract

    5.Free sample offer

    6.Quality assurance contract.

    Quality CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction for sale
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