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6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap 6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery from wholesalers
     
    Buy cheap 6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery from wholesalers
    • Buy cheap 6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery from wholesalers
    • Buy cheap 6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery from wholesalers

    6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF100C 6050-11
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery

    6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery


    TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


    Features:


    >Excellent thermal conductivity6.0W/mK

    >Self-adhesive without the need for additional surface adhesive
    >Highly compressible, soft, and elastic

    >Available in various thicknesses
    >Good chemical stability


    Applications:


    >CPU and GPU processors and other chipsets
    >High-performance computing (HPC)

    >Industrial equipment
    >Network communication devices

    >New energy vehicles

    Typical Properties of TS-TIF®100C 6050-11 Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.3g/ccASTM D297
    thickness0.012"(0.30mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)50 (Shore 00)ASTM 2240
    Continuos Use Temp-45 to 200℃******
    Dielectric Breakdown Voltage>5500 VACASTM D149
    Dielectric Constant7.0MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity6.0W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Product Specification
    Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
    Product Sizes:8" x 16"(203mm x406mm)
    Custom die-cut shapes and thicknesses are available.Please contact us for details.
    Store in a cool, dry place, away from fire and sunlight.
    6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery
    Packaging Details & Lead time

    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile

    Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


    Independent R&D team


    Q: How do I place an order?

    A:1. Click the "Sent messages" button to continue with the process.

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    4. We will reply you as soon as possible with Email or online.

    Quality 6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery for sale
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