Sign In | Join Free | My himfr.com
Home > Thermal Gap Filler >

Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory

Dongguan Ziitek Electronic Materials & Technology Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory from wholesalers
     
    Buy cheap Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory from wholesalers
    • Buy cheap Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory from wholesalers
    • Buy cheap Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory from wholesalers

    Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF100C 3030-11
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory

    Custom High Performance Cpu Silicone High Thermal Conductivity Pad thermal gap filler Factory


    TS-TIF®100C 3030-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


    Features:


    >Good thermal conductive
    >Moldability for complex parts
    >Soft and compressible for low stress applications
    >Naturally tacky needing no further adhesive coating
    >Available in varies thicknesses
    >Broad range of hardnesses available


    Applications:


    >Cooling components to the chassis of frame
    >High speed mass storage drives
    >Heat Sinking Housing at LED-lit BLU in LCD
    >Semiconductor automated test equipment (ATE)
    >CPU
    >Display card
    >Mainboard/mother board
    >Notebook
    >Power supply
    >Heat pipe thermal solutions

    Typical Properties of TS-TIF®100C 3030-11 Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.1g/ccASTM D297
    thickness0.012"(0.30mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)30 (Shore 00)ASTM 2240
    Continuos Use Temp-45 to 200℃******
    Dielectric Breakdown Voltage>5500 VACASTM D149
    Dielectric Constant4.5MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity3.0W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Product Specification
    Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
    Product Sizes:8" x 16"(203mm x406mm)
    Custom die-cut shapes and thicknesses are available.Please contact us for details.
    Store in a cool, dry place, away from fire and sunlight.
    Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory
    Packaging Details & Lead time

    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile

    Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


    Our services


    Online-service : 12 hours , Inquiry reply within fastest.


    Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

    Well-trained & experienced staff are to answer all your inquiries in English of course.

    Standard Export Carton Or Marked With Customer's Information Or Customized.

    Provide free samples


    After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

    we will help you to deal with it and give you satisfactory solution.


    FAQ:

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.


    Q: What's the thermal conductivity test method given on the data sheet ?

    A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


    Q: How to find a right thermal conductivity for my applications

    A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

    Quality Custom High Performance Cpu Silicone High Thermal Conductivity Pad Thermal Gap Filler Factory for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Dongguan Ziitek Electronic Materials & Technology Ltd.
    *Subject:
    *Message:
    Characters Remaining: (0/3000)