Low Thermal Inpedance 9W/MK Silicone Thermal Congductive Gel For
Vihicel Enginee Controler
Company Profile
With professional R&D capabilities and many year experiences in
thermal interface material industry, Ziitek company own many unique
formulations which are our core technologies and advantages. Our
goal is to provide quality & competitive products to our customers
worldwide aiming for long-term business cooperation.
TIF®090-11 is a soft silicone-based gap filler pad formulated with thermally
conductive fillers and a unique compound that combines excellent
themal performance with outstanding softness. Compared to
conventional thermal grease,TIF®090-11 has a higher viscosity, effectively preventing the
separation of fllers from the siliconebase. lt also offers more
stable bond line control under pressure,enhancing product
reliability. TIF®090-11 is applied similaty to traditional themal paste and is
compatible with various commercial equipment,such as dispensing
systems or automated production equipment. lt is suitable for a
wide range of high-power electronic components and packaging
formats, including flip-chip microprocessors (Flip-Chip MPU),PPGA,
micro BGA,BGA,DSP chips, circular accelerator chips, and LED
lighting modules.
Feature
> Thermal conductivity: 9.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
> Proven long-term reliability
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controler
> Telecom industry
> Semiconductor automatic laboratory equipment
| TIFTM090-11 Typical Property |
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Viscosity | 13000K mPa.s | GB/T 10247 |
| Specific Gravity | 3.45g/cm³ | ASTM D297 |
| Thermal conductivity | 9.0 W/mK | ASTM D5470 |
| Thermal resistance @10Psi(℃-in²/W) | 0.089 | ASTM D5470 |
| Thermal resistance @50Psi(℃-in²/W) | 0.055 | ASTM D5470 |
| Recommended Operating temp | -45~200℃ | ISO 22007-2 |
| Dielectric breakdown strength(V/mm) | ≥4000 | ISO 22007-2 |
| Bond line Thickness | 0.4 | ****** |
| D3-D10(Siloxane Content, ppm) | ＜100 | GC-MS |
| Flame Rating | V-0 | UL 94 |
Packing details
30 cc/pc, 98 pc/box;
300 cc/pc , 6 pc/box
We offer the custom packaged in syringes for automated despensing
applications.
Please contact us for confirming.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and
message to us.
This message should include any questions you might have about the
products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the
process and send your message to us
4. We will reply you as soon as possible with Email or online
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
