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Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material from wholesalers
     
    Buy cheap Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material from wholesalers
    • Buy cheap Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material from wholesalers
    • Buy cheap Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material from wholesalers

    Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF800QE Series
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

    Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material


    TIF®800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.


    Features:
    > Excellent thermal conductivity 13.0W/mK

    > Naturally tacky needing no further adhesive coating
    > High compliance adapts to various pressure application environments
    > Available in different thickness options

    > Easy release construction
    > Electrically isolating
    > High durability


    Applications:
    > Heat dissipation structure for radiators

    > Telecommunication equipment
    > Automotive electronics
    > Battery packs for electric vehicles

    > LED drivers and lamps

    > Mass storage devices
    > Automotive electronics
    > Set top boxes
    > Audio and video components

    Typical Properties of TIF®800QE Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.7g/ccASTM D297
    thickness0.030"(0.75mm)~0.200"(5.00mm)ASTM D374
    Hardness (thickness<1.0mm)35 (Shore 00)ASTM 2240
    Continuos Use Temp-40 to 200℃******
    Dielectric Breakdown Voltage≥5500 VACASTM D149
    Dielectric Constant8.0MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94 V0equivalent UL
    Thermal conductivity13.0W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Product Specification
    Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments of 0.01(0.25mm)
    Product Sizes:16" x 16"(406mm x406mm)
    Component Codes:
    Reinforcement Fabric: FG (Fiberglass).
    Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
    Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
    Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
    The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.
    Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material

    Packaging Details & Lead time


    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile

    With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


    Ziitek Culture


    Quality :

    Do it right the first time, total quality control

    Effectiveness:

    Work precisely and thoroughly for effectiveness

    Service:

    Quick response, On time delivery and Excellent service

    Team work:

    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

    Quality Thermal Pad GPU And CPU Heat Dissipation Pad High Thermal Conductive Pad With RoHS Compliant Material for sale
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