Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For
Gap Filling
With a wide range, good quality, reasonable prices and stylish
designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks,
DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power
products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED
Server Power products and others.
TIC®800G Series is a high-performance, cost-effective thermal interface material
featuringa unique grain-oriented structure that enables precise
conformity to device surfaces,thereby enhancing the thermal
conduction path and transfer efficiency. When the temperature
exceeds its phase transition point of 50°℃, the material softens
and undergoes phase change,effectively filling microscopic and
uneven gaps between components to form a low thermal resistance
interface,significantly improving heat dissipation performance.
Features
> Low thermal resistance
> Self-adhesive with no need for additional surface adhesives
> Low-pressure application environment
Applications
> Power conversion equipment
> Power supply and vehicle storage battery
> Large communication switch hardware
> LED TV, Lighting
> Laptop computer
| Typical Properties of TIC®800G Series |
| Product Name | TIC®805G | TIC®806G | TIC®808G | TIC®810G | TIC®812G | Test Method |
| Color | Gray | Visual |
| Thickness | 0.005" | 0.006" | 0.008" | 0.010" | 0.012" | ASTM D374 |
| (0.127mm) | (0152mm) | (0.203mm) | (0.254mm) | (0.305mm) |
| Density | 2.6g/cc | ASTM D792 |
| Recommended Operating Temperature (℃) | -40℃～125℃ | Ziitek Test Method |
| Phase Change Softening Temperature(℃) | 50℃~60℃ | Ziitek Test Method |
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 |
| Thermal Impedance(℃-cm²/W) @50 psi | 0.014 | 0.018 | 0.02 | 0.024 | 0.028 | ASTM D5470 |
Standard Thickness:
0.005"(0.127 mm),0.006"(0.152 mm), 0.008"(0.203 mm),0.010"(0.254
mm),0.012" (0.305 mm)
For other thickness options, please contact us.
Standard size: 10”× 16"(254 mm x 406 mm),16”x 400'(406 mm x 122 m).
TIC®800G series is supplied with a white release liner and backing pad.
Die-cutting with half-cut processing can include pull
tabs.custom-shaped samples are also available.
Pressure-Sensitive Adhesive. lt is not applicable to TIC®800G series products.
Reinforcement Material: No reinforcement materialrequired.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including
dimension , shape , color and coated on side or two sides adhesive
or coated fiberglass. If you want to place a custom order , pls
kindly offer a drawing or leave your custom order information .
Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other
requirements, such as adhesive and others. Please let us know these
factors first so that we could give you an exact price.
