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8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap 8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard from wholesalers
     
    Buy cheap 8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard from wholesalers
    • Buy cheap 8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard from wholesalers
    • Buy cheap 8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard from wholesalers

    8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF760R Series
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard

    8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard


    TIFTM760R thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


    Features:
    > Excellent thermal conductivity 8.5W/mK

    > Moldability for complex parts
    > Soft and compressible for low stress applications
    > Broad range of hardnesses available
    > Moldability for complex parts
    > Outstanding thermal performance


    Applications:

    > Cooling components to the chassis of frame

    > Set Top Box
    > Car Battery & Power Supply

    > Charging Pile
    > LED TV/ Lighting
    > Graphics Card Thermal Module

    Typical Properties of TIF760R Series
    ColorGrayVisual
    Construction & CompostionCeramic filled silicone elastomer******
    Specific Gravity3.55g/cm3ASTM D297
    Thickness1.5mmTASTM D374
    Hardness30±10 Shore 00ASTM 2240
    Operating Temp-45 to 200℃******
    Dielectric Breakdown Voltage>4000 VACASTM D149
    Dielectric Constant5.5MHzASTM D150
    Volume Resistivity≥1.0X10¹²Ohm-meterASTM D257
    Fire rating94-V0equivalent UL
    Thermal conductivity5.5W/m-KASTM D5470

    Standard Thicknesses:


    0.020" (0.51mm) 0.030" (0.76mm)

    0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

    0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

    0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

    0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

    0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

    0.190" (4.83mm) 0.200" (5.08mm)

    Consult the factory to alternate thickness.


    Product Thicknesses:

    Product Thicknesses:0.020-inch to 0.200-inch(0.5mm to 5.0mm)

    Product Sizes:8" x 16"(203mm x406mm)

    Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming.
    Safe disposal method does not require special protection. The storage condition is low temperature and dry , away from openfire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

    8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard
    Packaging Details & Lead time

    The packaging of thermal pad

    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile

    Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


    Independent R&D team


    Q: How do I place an order?

    A:1. Click the "Sent messages" button to continue with the process.

    2. Fill out the message form by entering a subject line, and message to us.

    This message should include any questions you might have about the products as well as your purchase requests.

    3. Click the "Send" button when you are finished to complete the process and send your message to us.

    4. We will reply you as soon as possible with Email or online.

    Quality 8.5W/MK Thermal Silicone Insulation Cooling Gap Filler Pad Thermal Transfer Gap Filler Pad For CPU GPU PC Motherboard for sale
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