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Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings from wholesalers
     
    Buy cheap Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings from wholesalers
    • Buy cheap Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings from wholesalers
    • Buy cheap Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings from wholesalers

    Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

    Ask Lasest Price
    Brand Name : Ziitek
    Model Number : TS-TIR300L
    Certification : RoHs
    Price : 0.1-10 USD/PCS
    Supply Ability : 100000pcs/day
    Delivery Time : 2-3 work days
    • Product Details
    • Company Profile

    Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

    Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings


    TIR®300L Series is a graphite-enhanced composite thermal interface material engineered forhigh thermal conductivity and reliable heat dissipation.Reinforced with an aluminum foil layer,it maintains structural integrity throughout handling and application. The material conforms well to a variety of surfaces, enabling efficient thermal contact and ease of assembly. lt isideally suited for use between power transistors and heat sinks, as well as in large-areathermal interface applications.


    Feature

    > Excellent thermal impedance
    > Replaces traditional thermal grease

    > High reliability
    > Easy to apply to surfaces


    Application

    > Between transistors and heat sinks

    > Between mechanical structures

    > Between heat sinks and externalcasings


    Typical Properties of TIR®300L series
    Product NameTIR®300LTest Method
    ColourBlackVisual
    Reinforcement CarrierAluminum*****
    Thickness range0.15 mmASTM D374
    Hardness90 Shore 00ASTM D2240
    Density1.4g/ccASTM D792
    Volume Resistivity(ohm-cm)1*102ASTM D257
    Continuous Use Temperature-60℃~ 180℃Ziitek Test Method
    Thermal Conductivity(W/mK)2.5ASTM D5470
    Thermal impedance(℃-in2/W)@30psi0.3ASTM D5470
    Thermal impedance(℃-in2/W)@50psi0.25ASTM D5470
    180° Peel Strength1.0N/25mmASTM D3330 (Steel,Immediate)
    Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings

    Packaging Details & Lead time


    1.with PET film or foam-for protection

    2. use Paper Card To Separate Each Layer

    3. export carton inside and outside

    4. meet with customers' requirement-customized


    Lead Time :Quantity(Pieces):5000

    Est. Time(days): To be negotiated


    Company Profile


    With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.


    FAQ:

    Q: Are you trading company or manufacturer ?

    A: We are manufacturer in China.


    Q: What kind of packaging you offer?

    A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.


    Q:Do big buyers have promotional prices?

    A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

    Quality Thermal Interface Material Graphite Composite Thermal Pad For Between Heat Sinks And External casings for sale
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