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Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes

Dongguan Ziitek Electronic Materials & Technology Ltd.
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    Buy cheap Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes from wholesalers
     
    Buy cheap Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes from wholesalers
    • Buy cheap Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes from wholesalers
    • Buy cheap Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes from wholesalers

    Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes

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    Brand Name : Ziitek
    Model Number : TIE™ 280-25AB
    Certification : RoHs
    Supply Ability : 1000KG
    Delivery Time : 2-3 work day
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    Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes

    Easy application epoxy potting compound glue electronic epoxy resin adhesive high thermal conductive potting epoxy adhes​


    TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.


    TIE280-25 A&B.pdf


    Features

    > Good thermal conductive: 2.5W/mK

    > Excellent insulation and smoothly sourface.

    > Low shrinkage

    > Low viscosity, expediting air releaseed.

    > Excellent in solvents and water proof.

    > Longer life time.

    > Excellent thermal shock efficiecy and impact resistance


    Application


    > Automotive starters potting; General potting Thermal detector potting

    > Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

    > Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

    > Power transformers and coils; Potting capacitors Potting of small electrical devices

    > Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

    > Optical / medical component adhesive


    Typical Uncured Material TIE™ 280-25A (Resin)
    ColorBlack
    Viscosity@25℃ Brookfield3,000 cPs
    Specific Gravity2.1 g/cc
    Shelf life @25℃ in sealed container12 months
    TIE™ 280-25B (Hardener)
    ColorBlack
    Viscosity@25℃ Brookfield5,000 cPs
    Shelf life @25℃ in sealed container12 months n

    Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100
    Viscosity @25℃4,000 cPs
    Working pot life (250 g @25℃)45 min
    Specific Gravity2.1g/ccn
    Cure Schedule
    Cure 12 hours at 25℃
    Cure 30 minutes at 70℃

    Cured Properties
    Hardness @25℃85 Shore D
    Service temperature-40℃ to +130℃
    Glass transition temperature Tg92℃
    Elongation0.10%
    Coefficient of thermal expansion, / ℃3.0 X 10-5
    Fire resistance ULMeet 94 V-0
    Moisture absorption % wt gain 24 hours water immersion @25℃0.1

    Thermal
    Thermal Conductivity2.5 W/m-K
    Thermal Impedance @10psi0.31 ℃-in²/W
    ELECTRICAL AS CURED
    Dielectric Strength300 volts / mil
    Dielectric Constant4.2 MHz
    Dissipation factor0.029 MHz
    Volume resistivity, ohm-cm @ 25℃3.0 X 1012

    Quality Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhes for sale
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