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Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop

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Brand Name :	ZIITEK
Model Number :	TIF7100Q thermal pad
Certification :	UL
Price :	negotiation
Supply Ability :	100000pcs/day
Delivery Time :	3-5 work days

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Product Details
Company Profile

Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop

Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop

Ziitek TIF7100Q is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF7100Q is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

TIF700Q-Series-Datasheet.pdf

Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop

Features

> Good thermal conductive: 8.0 W/mK

> Thickness: 2.5 mmT

> hardness:60±10

> Colour: gray

> Easy release construction
> Electrically isolating
> High durability

Applications

> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIF7100Q Series
Color	Blue	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.55 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	2.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	60±10	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Thermal conductivity	8.0W/mk	ASTMD5470	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	≥5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.5MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	≥ 5.2X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating(no.E331100)	94-V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	8.0 W/m-K	GB-T32064	Visua l/ ASTM D751	ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Cooling Thermal Conductive Silicone Gap Pad Filler For Laptop

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

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