Phase Change Pad Low Thermal Resistance Phase Change Material
TIC™805P series is low melting point thermal interface material.At 50℃, TIC™800P
series begins to soften and flow, filling the microscopic
irregularities of both the thermal solution and the integrated
circuit package surface, thereby reducing thermal resistance.
TIC™805P series is a flexible solid at room temperature and freestanding without
reinforcing components that reduce thermal performance.
TIC™805P series shows no thermal performance degradation after 1,000 hours@130℃,or
after 500cycles, from -25℃ to 125℃.The material softens and does
not fully change state resulting in minimal migration (pump out)at
operating temperatures.
TIC800P-Series-Datasheet.pdf
Features
> Highly compliant surfacecharacteristic with highthermal
conductivity.
> High thermal conductive andHigh dielectric strength.
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures.
Applications
| High Frequency Microprocessors |
| Notebook |
| Computer Serves |
| Memory Modules |
| Cache Chips |
| IGBTs |
| COB Led |
| Desktop PCs |
| CPU |
| Microprocessors |
| Chipsets |
| Graphic Processing Chips |
| Custom application |
| Servers |
| Memory Modules |
| Power semiconductors |
| Power conversion modules |
| LED Power Supply |
| LED Controller |
| LED Lights |
| LED Ceilinglamp |
| Monitoring the Power Box |
| AD-DC Power Adapters |
| Typical Properties of TIC™800P series |
| Product Name | TIC™805P | TIC™806P | TIC™810P | Test Method |
| Color | Pink | Visual |
| Thickness | 0.005"/0.126mm | 0.008"/0.203mm | 0.010"/0.245mm | ****** |
| Thickness Tolerance | ±0.0008"/±0.0019mm | ±0.0008"/±0.0019mm | ±0.0012"/±0.030mm | ****** |
| Specific Gravity | 2.2 g/cc | Helium Pycnometer |
| Temperature range | -25 to 125℃ | ****** |
| Phase Change Softening Temperature | 50℃-60℃ | ****** |
| Thermal conductivity | 0.95W/mK | ASTM D5470 |
| Thermal Impedance@50psi | 0.24℃-in²/W 0.15℃-cm²W | 0.053℃-in²/W 0.34℃-cm²W | 0.080℃-in²/W 0.52℃-cm²W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) ,0.008"(0.203mm), 0.010"(0.254mm)
Please contact us for confirming of the alternate thickness.
Standard Sizes :
10" x 16"(254mm x 406mm) , 16*400"(406mm*121.92M)
TIC™800P series are supplied with a white release paper and a
bottom liner.
TIC™800P series is available in kiss cut an extended pull tab liner
or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800P series
products.
Reinforcement:
No reinforcement is necessary.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Factory profile
Manufacturer of standard and custom thermally conductive pads for
electric vehicles, autopilot systems, mobile phones, CPUs,
motherboards, LCD-TV, telecom devices, and wireless hubs. Features
vary depending upon model, including low thermal resistance, high
thermal conductivity, and non-deforming. Silicone and non-silicone
thermal pads are also offered. Available with operating temperature
up to 180 degrees C. Serves the information, communications,
telecommunications, consumer electronics, lighting, medical, and
energy industries. RoHS and REACH compliant.
FAQ:
Q: Do you offer free samples ?
A: Yes, we are willing to offer free sample.
Q: What is your terms of payment ?
A: Payment<=2000USD, T/T in advance. Paying in time and faithful
for several months, we can apply other payment term for you, pay
together in every month or 30 days.
