TIF050-11 is a soft silicone putty thermal gap filler,which blend with
exclusive formula,that offer superior thermal performance, and
compressibility. Due to TIF050-11 is made by high vicosity silicon
oil ,that can prevent thermal formula seprate from it. Besides
,compared with traditionally thermal pad, it can control bonded
shifiting issue much better.
TIF050-11 operation mold is simliar as grease ,such as silkprint and screen
print or automatic injected facility. TIF050-11 can be applied on
chip micro processor,PPGAs,Micro BGA package,BGA package,DSP
chip,LED lighting and other high power electric component .
TIF050-11
Series Datasheet-REV02.pdf
Application
> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe ,Vihicel enginee controler
> Telecom industry, Semiconductor
Feature
> Thermal conductivity: 5.0W/mK
> Soft, very low compression
> Low thermal inpedance
> Operate automaticly
| TIFTM050-11 Typical Property |
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicon material | ********** |
| Viscosity | 2000,000cps | GB/T 10247 |
| Specific Gravity | 3.2 g/cc | ASTM D297 |
| Thermal conductivity | 5.0 W/mK | ISO 22007-2 |
| Thermal diffusivity | 1.695 mm2/s | ISO 22007-2 |
| Specific heat capacity | 2.3 MJ/m3K | ISO 22007-2 |
| Continuous Use Temperature | -45 ~200°C | ****** |
| Dielectric breakdown strength | 200 V/mil | ASTM D149 |
| Flame Rating | 94V0 | E331100 |
Package :
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing
applications.Please contact us for confirming.
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates
too much heat affecting its high performance when using. Plus
thermal products can control and manage heat to keep it cool to
some extent.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ:
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and
message to us.
This message should include any questions you might have about the
products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the
process and send your message to us
4. We will reply you as soon as possible with Email or online
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just
contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data
sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM
D5470 are utilized to test the thermal conductivity.
