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Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00

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Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00

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Brand Name :	ZIITEK
Model Number :	TIF100-40-11U
Certification :	UL and RoHs
Price :	negotiation
Supply Ability :	10000/day
Delivery Time :	3-5work days

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Product Details
Company Profile

Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00

Factory High Performance Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components

TIF™100-40-11U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of

the heat-generating electronic components.

TIF100-40-11U Datasheet-REV02.pdf

Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00

Features:

> Good thermal conductive: 4.0W/mK

> RoHS compliant
> UL recognized
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications:

> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

Typical Properties of TIF™100-40-11USeries
Color	Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Specific gravity	3.15g/cc	ASTM D297
Thickness range	0.020"(0.5mm)-0.200"(5.0mm)	******
Hardness	27Shore 00	ASTM 2240
Outgasing (TML)	0.35%	ASTM E595
Continuos Use Temp	-40 to 160℃	******
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	4.0 MHz	ASTM D150
Volume Resistivity(Ohm-cm)	1.0X10¹²	ASTM D257
Fire rating	94 V0	UL E331100
Thermal conductivity	3.0 W/m-K	ASTM D5470

Cooling Thermal Pad Soft Silicone Thermally Conductive Gap Filler Pad for Electronic Components 80±5 Shore 00

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

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